20MHz SMD5070 温补晶体振荡器
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产品属性：
| 价格： | |
|---|---|
| 供货总量： | |
| 所在地： | 广东深圳市 |
| 产品规格： | 20MHz SMD5070 晶体振荡器 |
| 包装说明： | 20MHz SMD5070 晶体振荡器 |
| 品牌： | 20MHz SMD5070 晶体振荡器 |
详细信息
20MHz SMD5070 晶体振荡器
20MHz SMD5070 晶体振荡器
|
ELECTRICAL PARAMETERS |
No. |
1 |
2 |
3 |
4 |
5 |
6 |
7 |
8 |
9 |
10 |
11 |
12 |
Characteristic |
Nominal Frequency |
Power Supply |
Frequency Stability |
Aging |
Operating Temperature Range |
Storage Temperature Range |
Input Current |
Symmetry |
Rise Time |
Fall Time |
Output Load |
Output Low Level |
Output High level |
Package Type |
Limits |
20.000MHz |
3.3VDC±10% |
±30ppm |
±30ppm |
-10℃~+70℃ |
-55℃~+125℃ |
10mA |
40/60% |
5nS max |
5nS max |
15pF |
0.33V max |
2.97V min |
SMD 5070 |
See page 5/6 |
At 50% VDD |
10%VDD ~90% VDD |
90%VDD ~10% VDD |
See Note 1 |
First Year |
Remark |
Note 1: include 25℃tolerance, operating temperature range, input voltage change, load change, shock and vibration. |
Output Waveform |
Tr |
Tf |
VOH |
90% VDD |
50% VDD |
VOL |
T1 |
T0=1/F0 |
Symmetry = T1/T0 * 100% |
10% VDD GND |
2 |
|
RELIABILITY SPECIFICATIONS |
No. |
1 |
Test Item |
High Temperature Storage |
Test Conditions |
Temperature: 125℃±10℃ Time:1000±24 Hours |
Temperature 1: -55℃±10℃ Temperature 2: 125℃±10℃ Temperature change between T1 and T2 at soonest Run 10 cycles, maintain T1 and T2 30minutes each in one cycle |
Pre-heat: 125℃60~120 Seconds Solder Temperature: 260℃±10℃ Time:5 Seconds |
3 Times Free Fall from 75cm height table to 3cm thickness hard wood board |
Temperature: 85℃ Relative Humidity: 85% Time: 500 Hours |
Temperature: 97℃ Time:8 Hours 230℃solder pot to check solderability |
Dip in flux 5~10 seconds Temperature: 230℃±10℃ Time:5 Seconds |
Temperature: 85℃ Time:500 Hours |
Temperature 1: -55℃±10℃ Temperature 2: 125℃±10℃ Temperature change between T1 and T2: 5 seconds 10 cycles, maintain T1 and T2 for 30 minutes each in one cycle |
Frequency Range: 10Hz~1000Hz Amplitude:1.5mm 40mins in each direction, total 120mins |
Reference |
MIL-STD-883E |
2 |
Temperature Cycle |
MIL-STD-883E |
3 |
Solder Heat Resistance |
Drop Test |
High Temperature, High Humidity Storage |
Steam Aging |
MIL-STD-202F |
4 |
MIL-STD-202F |
5 |
MIL-STD-883E |
6 |
MIL-STD-883E |
7 |
Solderability |
MIL-STD-883E |
8 |
Aging |
MIL-STD-883E |
9 |
Thermal Shock |
MIL-STD-202F |
10 |
Vibration |
MIL-STD-883E |
3 |
